Heat dissipation in 3D CPU is a critical issue. In collaboration with Prof. Lu Peng’s group, we exploit liquid-based cooling of a stacked 3D CPU with embedded microfluidic channels to enhance the performance of the 3D CPU chip. To maximize heat dissipation through microfluidic coolant flow, the flow channel structure and material must be optimized along with various CPU performance models. Microfluidic and thermal analysis shows a promising result of improved heat management on a multicore CPU.
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